Randall Redd, S-Bond Technologies LLC

Startup, 2006 Global Finals

Our patented S-Bond® active solders offer bonding solutions that are flux free, with no pre-plating required. Our S-Bond alloys bond metals, ceramics, glasses and composites and are capable of producing hermetic joints with excellent thermal and electrical conductivity. S-Bond active solders are available in a range of bonding temperatures maintaining structural properties of metals and providing, when needed for soldering process hierarchy. S-Bond low temperature bonding processes mean reduced thermal expansion mismatch when joining dissimilar materials.

2006-11-16T21:34:35+00:002006 Global Finals, Startup|